The 2026 Taipei International Computer Show (COMPUTEX) concluded successfully this past June. At this year's event, BenQ Qisda Group officially announced its entry into the AI Infrastructure sector, showcasing a comprehensive roadmap designed to address the global demand for high-density computing power.

 

As thermal design power (TDP) for next-generation, high-end AI and edge computing chips breaks through the 1,500W threshold, balancing "computing power, heat dissipation, and energy efficiency" has become the critical key to modern data center architecture. During the exhibition, the Group integrated its subsidiaries—AEWIN Technologies, Alpha Networks, and KTI (Kuan-Ting Innovation)—to launch a complete "Rack-level AI Data Center Solution." Powered by AMD EPYC Venice platforms, the solution demonstrates ultra-high compute density and strong vertical integration capabilities from standalone servers to full racks.

 

To address extreme thermal requirements, the Group's two-phase cooling brand, KTI, collaborated with thermal module leader Chaun-Choung Technology (CCI) / Asia Vital Components (AVC) to unveil the "Two-Phase Micro-Channel Lid (2P MCL) Cooling Solution" for next-gen AI servers. Utilizing the latent heat of saturated boiling within micro-channels, the technology efficiently removes heat, officially ushering AI computing into the era of "5000W+ Extreme Cooling."

 

Moving into the second half of the year, BenQ Qisda Group will continue to deepen its collaboration with global ecosystem partners, transforming the innovative technologies presented at COMPUTEX into commercial manufacturing strengths to deliver efficient and sustainable AI infrastructure solutions to worldwide clients.

 

**Read the full industry trend coverage on Central News Agency (CNA).

**Note: The industry trend analysis in this article is compiled based on public reports from Central News Agency (CNA) and internal technical insights.