Lamination silicone pads are used in flexible printed circuit board lamination processes. With good cushioning performance, they help ensure tighter and more even lamination during processing, improving overall lamination quality and process stability.
Available thicknesses include 1.0 mm, 1.6 mm, and 3.0 mm, allowing selection according to different lamination requirements and process conditions.
For detailed specifications and technical information, please contact us for more information.